Introduction to High-Efficiency Food Machinery

High-efficiency food machinery plays a pivotal role in the modern wafer biscuit production line, enabling manufacturers to achieve superior productivity and consistent product quality. The wafer biscuit production line, also referred to as the wafer production line, integrates multiple stages of wafer biscuit production into a streamlined, automated process. By leveraging advanced technology and automated production lines, manufacturers can significantly reduce manual labor, increase production speed, and ensure uniformity in every batch. The wafer biscuit production process utilizes specialized machines such as cream spreading machines and wafer cutting machines, which work together to produce delicious, high-quality wafer biscuits with remarkable efficiency. This seamless integration of machinery and technology not only enhances the overall production process but also ensures that each wafer biscuit meets the highest standards of taste and appearance.

Overview of Wafer Production Line

Our independently developed automatic series wafer production line is a modern production system integrating advanced automation technology and food processing craftsmanship. It is specially designed for large-scale production of high-quality wafer biscuits, wafer rolls, filled wafers and other series products. The entire production line adopts a modular design and can be flexibly configured according to customers’ capacity requirements (ranging from 50kg to 500kg per hour). It is compatible with various formulas and specifications, meeting production needs from traditional original flavor to high-end customized wafer products.

This production line features an advanced structure and compact structure, inspired by the technological improvements and layouts of existing plants. Designed specifically for the domestic market, it is a new generation product developed exclusively by our China based team, showcasing local expertise and innovation in wafer production equipment.

Key Components of a Biscuit Production Line

A modern biscuit production line, especially a wafer biscuit production line, is composed of several essential pieces of technology processing equipment that work in harmony to deliver high-quality wafer biscuits. The process begins with the batter mixer, the first technology processing equipment in wafer manufacturing, which ensures that all ingredients are thoroughly combined for a consistent wafer sheet. The cream mixer is responsible for blending sugar, butter, and other ingredients according to precise technology prescriptions, creating the perfect cream for spreading. The wafer oven, or baking oven, is at the heart of the production line, providing uniform heating and producing wafer blocks with unanimous heat colors. After baking, the wafer sheet cooling machine gently cools the wafer sheets to preserve their texture and prevent breakage. The cream spreading machine evenly applies the cream layer, while the wafer cutting machine, or cutting machine, slices the finished product into precise shapes and sizes. Each machine in the production line is designed for reliability, efficiency, and superior product quality, ensuring that every wafer biscuit meets exacting standards.

Core Advantages

1. Efficient and Stable Production Performance

• High Capacity Output: The standard configuration production line can produce 80-150kg of wafer products per hour, and the high-end model can reach 200-500kg, increasing production capacity by more than 30% compared with traditional equipment.
• Continuous Operation Capability: Adopting imported wear-resistant conveyor belts and intelligent temperature control systems, supporting 24-hour continuous production, with Overall Equipment Efficiency (OEE) stably above 90%.
• Energy-Saving Design: Thermal efficiency is increased to 85%, reducing energy consumption by 15-20% compared with the industry average, which can save a lot of energy costs every year.
• Reasonable Die Carrier Structure and Scientific Selection: The equipment adopts a reasonable die carrier structure and scientific selection of heating components, ensuring uniform heat colors, consistent product quality, and contributing to a high finished product rate.

2. Excellent Product Quality Control

• Precise Temperature Control System: Using PID intelligent temperature control technology, the furnace temperature control accuracy reaches ±1℃, ensuring uniform color and crispy taste of wafer sheets.
• Precise Thickness Adjustment: The gap between pressure rollers is controlled by servo motors, with wafer sheet thickness adjustment range of 0.3-3mm and accuracy up to ±0.05mm.
• Automatic Quality Inspection: Equipped with a high-definition visual inspection system, which can automatically identify and reject unqualified products, with a pass rate stably above 99.5%.
• High Finished Product Rate and Certified Products: The production line achieves a high finished product rate (not less than 98%), ensuring a high proportion of certified products. A high demoulding rate is maintained, which is crucial for efficient production and consistent product quality.

3. High Automation and Intelligence

• Fully Automatic Operation Process: From raw material mixing to finished product packaging, the whole process is automatic, and only 2-3 people are needed to monitor the entire production line.
• Intelligent Touch Control System: 10.1-inch touch screen human-machine interface, with built-in storage function for more than 100 product formulas, enabling one-key switching of production parameters.
• Remote Monitoring Function: Supporting IoT connection, which allows remote monitoring of production status, viewing of operation data and fault early warning through mobile phones or computers.

4. Safety, Hygiene and Compliance Design

• Food-Grade Materials: All parts in contact with food are made of 304 stainless steel and food-grade silica gel, complying with international standards such as FDA and EU 10/2011. Superior material selection is applied for key components, and the machine frame is made of steel conforming to international standards for enhanced durability and safety.
• Easy-to-Clean Structure: The equipment surface is electrolytically polished, equipped with a CIP in-place cleaning system, reducing cleaning time by 40%.
• Safety Protection System: The whole machine is equipped with emergency stop buttons, protective fences and safety light curtains, passing CE, ISO22000 and other certifications. The equipment is designed for reliable performance and easy maintenance, ensuring stable operation and minimal downtime.

The production line is engineered to minimize environmental impact by focusing on energy efficiency and waste reduction throughout the manufacturing process. This supports sustainable production and reduces the overall environmental footprint.

Production Line Customization

Production line customization is a key advantage of modern wafer biscuit manufacturing, allowing producers to adapt quickly to different recipes, product types, and market demands. By customizing elements such as the mixing system, cream mixer, and wafer oven, manufacturers can fine-tune the production line to accommodate unique formulations and production requirements. Whether producing classic flat wafers or innovative biscuit wafers, the flexibility of automated production lines and touch screen controls makes it easy to adjust production parameters and switch between products. Advanced technology enables seamless integration of new features and rapid response to changing consumer preferences, ensuring that the production line remains efficient and competitive. This adaptability not only supports the creation of a diverse range of wafer biscuits but also enhances overall production efficiency and product quality.

Main Functions and Technical Parameters

1. Raw Material Processing System

• Multiple Sets of Mixing Devices: 2-4 sets of stainless steel mixing tanks with a capacity of 50-200L, supporting simultaneous mixing of different raw materials.
• Automatic Feeding Function: Screw-type automatic feeder, which can precisely control the raw material conveying amount with an error ≤1%.
• Constant Temperature Control: The mixing tank is equipped with a constant temperature jacket, with a temperature control range of 20-60℃, ensuring the stability of the batter.
• The system adopts a separate delivery and automatic circulation system to improve efficiency and product quality during the mixing process.

2. Wafer Baking System

• Baking Methods: Various options including electric heating/gas heating/heat-conducting oil heating.
• Baking Temperature: Adjustable from room temperature to 300℃, with independent temperature control in different zones.
• Baking Speed: Stepless speed regulation of 0.5-5m/min, adapting to the needs of products with different thicknesses.
• Mold Specifications: Various shapes of molds (square, round, special-shaped) can be customized, with size range of 50-150mm.
• The baking oven is equipped with high-quality baking plates and scientifically selected heating components to ensure uniform heat distribution and consistent baking results.

3. Cooling and Laminating System

• Multi-Layer Cooling Channel: 3-5 layers of stainless steel cooling mesh belts, with adjustable cooling time.
• Automatic Laminating Function: Servo motor controls the laminating accuracy, which can realize precise lamination of 2-10 layers of wafer sheets.
• Tension Control System: Automatically adjusts the mesh belt tension to prevent wafer sheets from breaking.
• A cooling tower is used for natural cooling of wafer blocks, maintaining product quality by controlling temperature during the cooling process.

4. Filling and Cutting System

• Multiple Sets of Filling Devices: 2-6 sets of independent filling pumps, which can realize simultaneous filling of multiple flavors.
• Cutting Methods: Two cutting modes of round knife/straight knife, with adjustable cutting size of 50-200mm.
• Crumb Recycling: Equipped with a negative pressure dust suction device, with a recycling rate of over 95%.

5. Система управления

• Core Controller: Using PLC control system with a response speed ≤0.1ms.
• Data Recording: Automatically records 30 days of production data, supporting U disk export.
• Fault Diagnosis: Equipped with intelligent fault diagnosis function, which can display fault points and troubleshooting suggestions.
• The power supply system is designed to use compressed air instead of electricity in certain processes, reducing overall energy consumption.

Detailed Production Process

1. Raw Material Preparation Stage

• Put raw materials such as flour, starch, oil, and sugar into the raw material warehouse according to the formula ratio.
• The automatic weighing system precisely measures each component, with the error controlled within ±0.5%.
• Liquid raw materials are transported to the mixing tank through constant temperature pipelines to ensure stable temperature.

2. Batter Preparation Stage
   

• Raw materials enter the mixing tank in a preset order, first mixed at low speed for 3 minutes, then stirred at high speed for 5-8 minutes.
• During the stirring process, the batter viscosity is automatically detected, and the stirring speed is adjusted in real time.
• The prepared batter enters the storage tank and is left to stand at a constant temperature of 40-50℃.

3. Baking and Forming Stage
   

• The batter is evenly coated on the baking mold through a metering pump.
• Enter the tunnel oven, going through three stages: preheating zone (100-150℃), baking zone (200-280℃), and setting zone (150-180℃).
• The formation of the wafer block is achieved through precise control of the baking process, with high-quality heating components ensuring uniform coloration and texture.
• The baked wafer sheets are separated by the demoulding device and enter the cooling system.

4. Cooling and Laminating Stage
   

• The wafer sheets pass through the multi-layer cooling channel, with the temperature dropping from 120℃ to room temperature (around 25℃).
• A cooling tower is used for natural cooling of the wafer block, and the machine runs slowly during this stage to ensure the quality and prevent damage.
• The cooled wafer sheets are accurately aligned through the photoelectric positioning system.
• Automatically laminated according to the preset number of layers, with the laminating accuracy controlled within ±1mm.

5. Filling and Cutting Stage

• The laminated wafer blanks pass through the filling station, and the filling pump evenly injects the filling into the layers.
• Excess filling is processed by the scraping device to ensure a flat surface.
• Enter the cutting system, precisely cut according to the set size, and remove the边角料 at the same time.

6. Inspection and Output Stage
   

• The cut finished products pass through the visual inspection system to reject products with deformation, missing corners, and uneven filling.
• Qualified products are conveyed to the packaging area through the conveyor belt.
• Production data is updated in real time, displaying key indicators such as daily output and pass rate on the central control screen.

The wafer biscuit machine and the wafer biscuit manufacturing process enable minimal manual intervention and efficient, large-scale production of biscuit wafers.

Wafer Manufacturing Process

The wafer manufacturing process is a carefully orchestrated sequence of steps, each supported by advanced technology and highly efficient machines. It begins with the preparation of raw materials, which are mixed into a smooth wafer batter using automated mixing systems. The batter is then deposited onto baking plates in the wafer oven, where it is baked into thin, crisp wafer sheets under uniform heating conditions. Once baked, the wafer sheets are transferred to the wafer sheet cooling machine, which gradually reduces their temperature to prevent warping and maintain their delicate texture. After cooling, the cream spreading machine applies a consistent layer of cream between the wafer sheets, creating the signature multi-layered structure of wafer biscuits. The assembled sheets are then cut into individual wafer biscuits using a wafer cutting machine, ensuring precise dimensions and clean edges. Throughout the entire production process, automated production lines and touch screen controls minimize manual intervention, resulting in a highly efficient, reliable, and scalable wafer manufacturing operation that consistently delivers a superior final product.

Cooling and Packaging

Cooling and packaging are vital stages in the wafer biscuit production process, directly impacting the quality and shelf life of the finished product. After baking, wafer sheets are transferred to a wafer sheet cooling machine, which cools them gradually to a stable temperature, preventing deformation and preserving their crisp texture. Once cooled, the wafer sheets are filled with cream and cut into individual wafer biscuits, ready for packaging. Packing machines are then used to efficiently package the wafer biscuits, with options for various packaging formats to suit different market needs. These machines are designed for reliability and speed, ensuring that each wafer biscuit is protected from moisture and contamination, and that the delicious taste and freshness are maintained from production to the consumer. The integration of advanced cooling and packing machines within the production process guarantees that every wafer biscuit reaches the market in optimal condition.

Applicable Product Range

– Traditional wafer biscuits: square wafers, round wafers, special-shaped wafers.

– Filled wafers: single-layer filled, multi-layer filled, mixed flavor filled.

– Wafer rolls: straight rolls, spiral rolls, filled wafer rolls.

– Customized products: can develop wafer products with special shapes and structures according to customer needs.

Services and Support

– Installation and Commissioning: A professional technical team provides on-site installation and commissioning to ensure the equipment reaches the best operating condition.

– Personnel Training: Provides full-process training on operation, maintenance and repair to ensure that customers’ employees master proficiently.

– Quality Assurance Service: 18-month warranty for the whole machine, 24-month warranty for core components.

– Spare Parts Supply: Establishes regional spare parts centers to ensure that key spare parts are delivered within 48 hours.

– Technical Upgrade: Provides lifelong technical upgrade services to ensure that the equipment maintains an advanced level for a long time.

For more technical details or customized solutions about the wafer production line, please contact our sales team, and we will provide you with professional consultation and solutions.